Method for manufacturing semiconductor device, semiconductor device, and laser irradiation apparatus

ABSTRACT

It is an object of the present invention to provide a laser irradiation apparatus being able to crystallize the semiconductor film homogeneously while suppressing the variation of the crystallinity in the semiconductor film and the unevenness of the state of the surface thereof. It is another object of the present invention to provide a method for manufacturing a semiconductor device using the laser irradiation apparatus which can suppress the variation of on-current, mobility, and threshold of TFT, and to further provide a semiconductor device manufactured with the manufacturing method. 
     A method for manufacturing a semiconductor device comprising the steps of adding the first noble gas to the semiconductor film formed over the insulating surface with the ion doping method and irradiating the semiconductor film with the first noble gas added therein with the laser light in an atmosphere of second noble gas, wherein the magnetic field is applied to the semiconductor film with the first noble gas added when the laser light is irradiated.

TECHNICAL FIELD

The present invention relates to a pulsed laser irradiation apparatus ora continuous wave laser irradiation apparatus, which is used forcrystallizing a semiconductor film. In addition, the present inventionrelates to a method for manufacturing a semiconductor device including aprocess to crystallize a semiconductor film with the laser irradiationapparatus, and to a semiconductor device manufactured with the abovemanufacturing method.

BACKGROUND ART

Thin film transistor with a poly-crystalline semiconductor film(poly-crystalline TFT) is superior to TFT with an amorphoussemiconductor film in its mobility by double digits or more. Thepoly-crystalline TFT has an advantage that a pixel portion and itsperipheral driver circuit in a semiconductor display device can beintegrated on the same substrate.

The poly-crystalline semiconductor film can be formed over aninexpensive glass substrate when a laser annealing method is employed.However, the energy of the laser light output from the oscillatorfluctuates by at least a few percentage points due to the variousreasons. This fluctuation prevents homogeneous crystallization of thesemiconductor film. When the crystallinity of the poly-crystallinesemiconductor film varies due to the inhomogeneous crystallization, thecharacteristic of TFT using the poly-crystalline semiconductor film asits active layer, such as on-current or mobility also varies.

For example, in the case of an active matrix light-emitting device inwhich a light-emitting element and TFT for controlling current supply tothe light-emitting element are provided in each pixel, when theon-current of TFT varies, the luminance of the light-emitting elementalso varies accordingly.

FIG. 18(C) shows the energy density in every shot of pulsed laser light.FIG. 18(B) shows the drain current of TFT for supplying the current tothe light-emitting element in the pixel corresponding to every shot.FIG. 18(A) is a photograph of the pixel portion emitting light in fact.It is noted that the photograph of the pixel portion in FIG. 18(A) isextended to the lateral direction in accordance with the number of thesteps in the scanning direction and with the number of shots in order tomake it easier to understand the relation with the graphs shown in FIG.18(B) and FIG. 18(C).

The luminance of the light-emitting element is in proportion to thecurrent intensity in the light-emitting element and the currentintensity in the light-emitting element is almost equal to the draincurrent intensity of the TFT supplying the current to the light-emittingelement. When FIGS. 18(B) and 18(C) are compared, it is understood thatthe drain current of TFT corresponding to the shot having high energydensity is also high. And when FIGS. 18(A) and 18(B) are compared, it isunderstood that when the drain current is high, the luminance of thecorresponding part in the pixel portion is also high.

Therefore, FIG. 18 shows that the energy fluctuation of the laser lightcorresponds to stripes appeared as light and shade of luminance in thepixel portion of the light-emitting device.

Moreover, when the semiconductor film is crystallized by irradiating thelaser light in the atmosphere, the surface of the semiconductor filmbecomes somewhat rough. The higher the energy intensity of the laserlight is, the rougher the surface of this semiconductor film becomes.The light is scattered to give more brightness in the region whosesurface is rougher. Therefore, sometimes the striped light and shade isvisible at an interval of several mm due to the energy fluctuation.

It is noted that the state of the surface of the semiconductor film isclosely related to the oxygen in the atmosphere at the laser lightirradiation according to the patent document 1 shown below.

[Patent Document 1]

Published patent application No. 2000-138180 (P. 3–P. 4)

The patent document 1 describes that the more oxygen the atmospherecontains, the rougher the surface of the semiconductor film crystallizedby irradiating the laser light becomes. Moreover, the patent document 1also describes to spray the semiconductor film with Ar when the laserlight is irradiated.

When the surface of the semiconductor film becomes rough, interfacestate density at the interface between the semiconductor film and thegate insulating film formed so as to contact the semiconductor filmbecomes high and the threshold voltage shifts to the normally-off side.Therefore, when the state of the surface of the semiconductor filmbecomes uneven due to the energy fluctuation of the laser light, theinterface state density varies at the interface between thesemiconductor film and the gate insulating film formed afterward, and asa result the threshold of TFT varies.

DISCLOSURE OF THE INVENTION

Problem to be Solved by the Invention

In view of the problem described above, it is an object of the presentinvention to provide a laser irradiation apparatus to suppress thevariation of the crystallinity of the semiconductor film and theunevenness of the state of the surface thereof, and to make it possibleto crystallize the semiconductor film homogeneously. In addition, it isalso an object of the present invention to provide a method formanufacturing a semiconductor device using the laser irradiationapparatus which can suppress the variation of the on-current, themobility, and the threshold of TFT. Furthermore, it is also an object ofthe present invention to provide a semiconductor device manufactured bythe above manufacturing method.

Means for Solving the Problem

The energy density of the laser light is assumed to have a very closerelation with the crystallinity of the semiconductor film. However, thepresent inventors considered that such a wide variation of thecrystallinity as causing the visible variation of the luminance cannotbe explained only with the fluctuation of the energy density by a fewpercentage points. Therefore, the present inventors examined thesecondary element caused by the fluctuation of the energy density thataffects the crystallinity.

The present inventors focused on the fact that oxygen or nitrogenexisting in the atmosphere is mixed into the semiconductor film meltedby the laser light.

FIG. 19(A) is a cross-sectional view of the semiconductor film 9000 whenpulsed laser light is irradiated in the air. It is considered that theregion 9001 irradiated with the laser light in the semiconductor film9000 is melted completely to be in a state of liquid phase, or is notmelted completely to be in a state of partially liquid phase. Since themelted silicon easily reacts with oxygen or nitrogen in the air, a verythin insulating film 9003 such as silicon oxide, silicon nitride, orsilicon nitride oxide is formed over the surface of the semiconductorfilm 9000.

Then FIG. 19(B) is a cross-sectional view of the semiconductor film 9000when the laser light is scanned from the state shown in FIG. 19(A). Inthe case of using the pulsed laser light, the region irradiated with thelaser light moves discontinuously. In the process to scan the laserlight all over the surface of the semiconductor film, as shown in FIG.19(B), the region 9001 irradiated with the laser light in FIG. 19(A) andthe region 9002 irradiated with the laser light in FIG. 19(B) areoverlapped partially one another.

In FIG. 19(B), the region 9002 is melted by the irradiation of the laserlight. The semiconductor film, which is melted instantaneously by theirradiation of the laser light, seems to be recrystallized at acomparatively rapid rate of several tens m/s when irradiated with thepulsed laser beam, and several cm/s when irradiated with the CW laserbeam. Therefore, it is assumed that the impurities exist in thesemiconductor film more than the solubility in thermal equilibriumstate. Based on this assumption, it is considered that the impuritiesare easy to be mixed into the semiconductor film from the insulatingfilm that contacts the semiconductor film when the laser light isirradiated. This is notable particularly in the case of the pulsed laserlight recrystallizing rapidly.

It is considered that the part of the insulating film 9003 formed overthe surface of the region 9001, which is overlapped with the region9002, is melted and is mixed into the region 9002 as a chip of siliconoxide, silicon nitride, silicon nitride oxide or the like. Therefore,since the thickness of the insulating film 9003 depends on the energydensity of the laser light, the fluctuation of the energy density ispredicted to lead directly to the fluctuation of the impurityconcentration in the semiconductor film.

Moreover, not only the insulating film but also the impurities in theair are likely to be mixed directly. The irradiation time of the laserlight for crystallizing the semiconductor film also depends on thescanning speed, and in the case of using the pulsed laser beam, theirradiation time of the laser light ranges approximately from several nsto several tens ns. On the other hand, in the case of using the CW laserbeam, the irradiation time is comparatively long, ranging fromapproximately several μs to several tens μs. Therefore, the CW laserbeam melts the semiconductor film longer than the pulsed laser beam. Forthis reason, it is considered that the impurities are easier to be mixedinto the semiconductor film in the case of using the CW laser beam. Thehigher the temperature of the semiconductor film is, the more easily theimpurities in the air dissolve in the semiconductor film, because thesolubility of the gas increases. Therefore, it is considered that whenthe heat given to the semiconductor film differs due to the fluctuationof the energy density, the impurity concentration in the semiconductorfilm varies.

Since the impurities such as oxygen or nitrogen mixed from a chip of theinsulating film and the atmosphere are positive in segregationcoefficient in the melted semiconductor film, they are easy to besegregated in the grain boundary in recrystallization. This phenomenonis called grain boundary segregation and is more likely to be seen inthe impurities whose solid solubility is lower. The segregatedimpurities such as oxygen and nitrogen are easy to combine with siliconto form the insulator such as silicon oxide, silicon nitride oxide, orsilicon nitride. And the insulating film segregated as a chip or theinsulator existing in the grain boundary prevents the carrier frommoving in the semiconductor film and this causes the decreasing of themobility.

Therefore, it is considered that the variation of the impurityconcentration in the semiconductor film due to the fluctuation of theenergy density causes the variation of the mobility in the semiconductorfilm.

Consequently, the present inventors tried to enhance the crystallinityby performing the following processes. Ar is doped in the semiconductorfilm before crystallizing it with the laser light irradiation, and thenthe semiconductor film is irradiated with the laser light in theatmosphere of Ar. It is noted that the doping element is not limited toAr and any other zeroth elements (noble gas element) may be employed.Moreover, when the laser light is irradiated, the atmosphere of Ar isnot always necessary, and the gas of the zeroth element, or the gas ofthe zeroth element with hydrogen added may be employed. The zerothelement is appropriate in point of that the zeroth element does notbecome a dopant because it is neutral in the semiconductor film, andthat the zeroth element is hard to form the chemical compound with theelement constituting the semiconductor typified by silicon.Particularly, since Ar is inexpensive, the cost required formanufacturing a semiconductor device can be reduced.

The processes from doping Ar up to irradiating the laser light to thesemiconductor film are performed in the load lock system chamber inorder not to expose the semiconductor film in the atmosphere includingoxygen. For example, with the manufacturing apparatus of themulti-chamber system including a chamber to perform the process to forma semiconductor film, a chamber to perform the process to dope Ar to thesemiconductor film, and a chamber to irradiate the semiconductor filmwith the laser light, it is possible to perform a series of processes inorder without exposing the semiconductor film to the atmosphere.

The mass of the gas that can melt in a certain amount of liquid is inproportion to the partial pressure of the gas on the liquid. Therefore,when the semiconductor film is doped with Ar or the like in advance andthen is irradiated with the laser light in the atmosphere of Ar or thelike, it is possible to prevent oxygen and nitrogen from mixing into thesemiconductor film from the atmosphere effectively. In addition, whenthe laser light is irradiated, the insulating film can be prevented frombeing formed on the surface of the semiconductor film and a chip of theinsulating film can be prevented from mixing into the semiconductorfilm.

Therefore, it is possible to suppress the variation of the impurityconcentration due to the fluctuation of the energy density, and tosuppress the variation of the mobility of the semiconductor film. In TFTformed using the above semiconductor film, it is also possible tosuppress the variation of the on-current in addition to the mobility.

As described in the patent document 1, empirically, when the laser lightis irradiated in the atmosphere including oxygen, the surface of thesemiconductor film becomes rough. With the structure of the presentinvention, however, it is possible to suppress the roughness of thesemiconductor surface due to the irradiation of the laser light and tosuppress the variation of the threshold caused by the variation of theinterface state density.

In addition, when the semiconductor film melts, it is considered thatthe flow is generated in the semiconductor film due to the temperaturegradient or the difference of the surface tension. The present inventorsconsidered that the impurities such as oxygen and nitrogen mixed fromthe surface of the semiconductor film are distributed in such a way thatthe impurities are segregated locally due to the flow. The irregularityof the flow in the semiconductor film increases with the temperature ofthe semiconductor film. As a result, since the impurities are dissolvedagain microscopically in recrystallization, the interface between thesolid phase and the liquid phase becomes inhomogeneous, and thereby theimpurities are segregated irregularly.

Consequently in the present invention, a magnetic field is applied tothe semiconductor film when the laser light is irradiated in order tosuppress the flow. Silicon is semiconductor in a solid phase, while itis conductive material in a liquid phase. When the magnetic field isapplied to the conductive material, the current is generated inside theconductor moving across the magnetic lines of force according toFleming's law, and the conductive material receives a force from adirection opposite to the moving direction by this current. As a result,the viscosity increases to suppress the flow. Therefore, a segregationof the impurities due to the flow can be suppressed and the variation ofthe mobility and the on-current can be also suppressed.

In addition, it is also considered that when the viscosity of thesemiconductor film increases by applying the magnetic field, it ispossible to prevent the impurities from mixing into the semiconductorfilm and to enhance the mobility of the semiconductor film further.

It is noted that the magnetic field may be applied by electromagneticinduction with a coil or the like, or may be applied by a permanentmagnet. As a permanent magnet, a neodymium magnet, a samarium-cobaltmagnet, an anisotropic ferrite magnet, an isotropic ferrite magnet, analnico magnet, a NdFeB bonded magnet, or the like can be used.

It is noted that in the present invention, the semiconductor film may beirradiated with the laser light after the catalyst element is addedthereto in order to enhance the crystallinity.

ADVANTAGEOUS EFFECT OF THE INVENTION

According to the present invention, oxygen and nitrogen are effectivelyprevented from mixing into the semiconductor film by doping Ar or thelike in the semiconductor film in advance, and by irradiating the laserlight in the atmosphere of Ar or the like. Therefore, the variation ofthe impurity concentration due to the fluctuation of the energy densitycan be suppressed and the variation of the mobility of the semiconductorfilm can be also suppressed. Moreover, in TFT formed using thesemiconductor film, the variation of the on-current in addition to themobility can be also suppressed.

Moreover, as described in patent document 1, empirically when the laserlight is irradiated in the atmosphere including oxygen, the surface ofthe semiconductor film becomes rough. When the laser light is irradiatedin the atmosphere of Ar or the like, however, the surface of thesemiconductor film can be prevented from being rough, and the variationof the threshold due to the variation of the interface state density canbe suppressed.

In addition, it becomes possible to suppress the segregation of theimpurities due to the flow by applying the magnetic field to thesemiconductor film when irradiating the laser light. When the magneticfield is further applied, the viscosity of the semiconductor film isincreased so that the impurities are prevented from mixing into thesemiconductor film. As a result, the variation of the mobility and theon-current can be suppressed.

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment Mode 1

A laser irradiation method according to the present invention isexplained with reference to FIG. 1. FIG. 1(A) shows an aspect in which asemiconductor film 101 formed over a substrate 100 is irradiated withthe laser light. According to the present invention, before thecrystallization by the irradiation of the laser light, the zerothelement, which is hard to form a chemical compound with semiconductorand which is neutral in the semiconductor so that it does not functionas a dopant, is doped in the semiconductor film 101.

He, Ne, Ar, Kr, Xe, or the like is typically given as the doped zerothelement. As well as doping P or B imparting conductivity to thesemiconductor film, the zeroth element can be doped by converting itinto plasma and accelerating it by porous electrode. In addition, unlikeP and B that are regulated legally, the above gases do not need to bediluted with hydrogen. As a result, throughput can be increased.

For example, in the case of Ar, Ar is doped so that the concentration inthe semiconductor film ranges from 1×10¹⁸ to 1×10²¹ atoms/cm³,preferably from 5×10¹⁸ to 5×10²⁰ atoms/cm³. The accelerating voltageaffects the concentration distribution of Ar in a direction of thethickness of the semiconductor film 101. Therefore, the accelerationvoltage is determined appropriately by the condition in which theconcentration is made higher toward the surface side of the film, theconcentration is made higher toward the substrate side of the film, orthe concentration is made uniform all over the film.

In addition, the semiconductor film 101 is irradiated with the laserlight in the atmosphere of the zeroth element described above. It isnoted that the zeroth element doped in the semiconductor film and thezeroth element used when the laser light is irradiated do not alwayshave to be the same.

It is noted that the laser light may be irradiated in the atmosphere ofthe gas of the zeroth element added with hydrogen. In this case, thepartial pressure of hydrogen is set in the range of 1 to 3%.

Moreover, in FIG. 1(A), a reference numeral 102 corresponds to a beamspot obtained by the pulsed laser light irradiated to the semiconductorfilm 101. A relative position of the beam spot 102 to the semiconductorfilm 101 is moved by scanning the substrate 100 in the directionindicated by an arrow of a continuous line.

A reference numeral 103 corresponds to a magnetic pole of a magneticcircuit that can apply a magnetic field in the semiconductor film 101,particularly in the region where the beam spot 102 is irradiated. Themagnetic lines of force in the magnetic field generated by the magneticpole 103 are indicated with an arrow of a dotted line.

To clarify the relation between the direction of the magnetic lines offorce and the scanning direction of the substrate with respect to thesemiconductor film 101, FIG. 1(B) is a top view of the semiconductorfilm 101, and FIG. 1(C) is a cross-sectional view taken along a dottedline A–A′ in FIG. 1(B). In FIG. 1(B), the scanning direction of thesubstrate 100 exists in the surface of the substrate 100 as indicated byan arrow of a continuous line. A relative position of the beam spot 102to the semiconductor film 101 is moved to the direction indicated by awhite arrow by the scanning of the substrate 100.

In addition, the magnetic pole 103 is provided on the side of thesubstrate 100 opposite to the side irradiated with the laser light. Andthe magnetic lines of force are directed to the surface of thesemiconductor film 101 from the magnetic pole 103.

It is noted that the surface formed with the semiconductor film 101 isnot always perpendicular to the direction of the magnetic lines offorce. In the present invention, it does not lead to any problems aslong as the magnetic component in which the direction of passingmagnetic lines of force is almost constant is applied in the part of thesemiconductor film 101 irradiated with the beam spot 102.

And the magnetic flux density in the part of the semiconductor film 101irradiated with the beam spot 102 is set in the range of 1000 G to 10000G, preferably in the range of 1500 G to 4000 G.

FIG. 1(B) shows a case in which a surface formed with the semiconductorfilm 101 is perpendicular to the direction of the magnetic lines offorce in the part of the semiconductor film 101 irradiated with the beamspot 102. In this case, the scanning direction of the substrate 100 andthe direction of magnetic lines of force are also perpendicular. Thedirection of the magnetic lines of force, however, is not limited tothat shown in FIG. 1(B).

In order to raise the proportion of the region having the homogeneousenergy density, it is preferable that the beam spot 102 has a linear,rectangular, or elliptical shape in which a ratio of the length of themajor axis thereof with respect to that of the minor axis thereof isfive or more. In this embodiment mode, as shown in FIG. 1(B), Wb, whichis the length of the beam spot 102 in the direction of its major axis,is made shorter than W_(m1), which is the width of the magnetic pole 103in the direction of the major axis of the beam spot 102, so that thedirection of passing magnetic lines of force can be kept almostconstant.

In the present invention, the known pulsed gas laser or pulsed solidlaser can be used. For example, a YAG laser, a YVO₄ laser, a YLF laser,a YAlO₃ laser, a glass laser, a ruby laser, an alexandrite laser, a Ti:sapphire laser, a forsterite laser (Mg₂SiO₄), or the like, each of whichis doped with Cr, Nd, Er, Ho, Ce, Co, Ti, or Tm can be given. Thefundamental wavelength of these lasers depends on the doped material,but the laser light having a wavelength of approximately 1 μm can beobtained as the fundamental wave. A second harmonic, a third harmonic,and a fourth harmonic to the fundamental wave can be obtained through anon-linear optical element.

In the present invention, as described above, oxygen and nitrogen can beprevented from mixing into the semiconductor film effectively by dopingAr or the like in the semiconductor film in advance and by irradiatingthe laser light in the atmosphere of Ar or the like. Therefore, thevariation of the impurity concentration due to the fluctuation of theenergy density can be suppressed. Moreover, the variation of themobility of the semiconductor film can be also suppressed. And in TFTformed using the semiconductor film, the variation of the on-current inaddition to the mobility can be suppressed.

As described in patent document 1, empirically when the laser light isirradiated in the atmosphere including oxygen, the surface of thesemiconductor film becomes rough. However, when the laser light isirradiated in the atmosphere of Ar or the like, the surface of thesemiconductor film can be prevented from being rough, and the variationof the threshold due to the variation of the interface state density canbe also suppressed.

Furthermore, when the magnetic field is applied to the semiconductorfilm when the laser light is irradiated, the segregation of theimpurities due to the flow can be suppressed. By further applying themagnetic field, the viscosity of the semiconductor film can beincreased, and thereby the impurities are prevented from mixing into thesemiconductor film. As a result, it is possible to suppress thevariation of the mobility and the on-current.

Although this embodiment mode explained the case in which the pulsedlaser light is irradiated, the CW laser light may be also irradiated.FIG. 2(A) is a drawing where the CW laser light is irradiated to thesemiconductor film 101 formed over the substrate 100. Moreover, FIG.2(B) is a top view of the semiconductor film 101 in the case where theCW laser light is irradiated. And FIG. 2(C) is a cross-sectional viewtaken along the dotted line A–A′ in FIG. 2(B). It is noted that the samereference numerals as those in FIG. 1 are used in FIG. 2 in order toclarify the contrast with FIG. 1.

The different point between FIG. 1 and FIG. 2 is that a referencenumeral 102 in FIG. 2 corresponds to the beam spot obtained by the CWlaser light irradiated to the semiconductor film 101.

The known CW gas laser or CW solid laser can be employed as the laser inFIG. 2. As the gas laser, an Ar laser, a Kr laser, and the like can begiven. As the solid laser, a YAG laser, a YVO₄ laser, a YLF laser, aYAlO₃ laser, a Y₂O₃ laser, a glass laser, a ruby laser, an alexandritelaser, a Ti: sapphire laser, and the like can be given. The higherharmonic with respect to the fundamental wave can be obtained throughthe non-linear optical element.

Particularly when the CW solid laser emitting the second harmonic, thethird harmonic, or the fourth harmonic with respect to the fundamentalwave is employed, a crystal having a large grain can be obtained.Typically it is preferable to use the second harmonic (532 nm) or thethird harmonic (355 nm) of the Nd: YVO₄ laser (fundamental wave 1064nm). Specifically, the laser light emitted from the CW YVO₄ laser isconverted into the harmonic with an output of 10 W through thenon-linear optical element. Moreover, the harmonic can be emitted alsoby inserting YVO₄ crystal and non-linear optical element in theresonator.

[Embodiment Mode 2]

This embodiment mode explains one mode of the present invention wherethe magnetic field is applied to the direction different from that shownin FIG. 1 and FIG. 2.

FIG. 3(A) is a top view of the semiconductor film 201, and FIG. 3(B) isa cross-sectional view taken along the dotted line A–A′ in FIG. 3(A). Itis noted that a reference numeral 201 corresponds to the semiconductorfilm formed over the substrate 200 in FIGS. 3(A) and 3(B).

The scanning direction of the substrate 200 exists in the surface of thesubstrate 200 as indicated by an arrow of a continuous line. Inaddition, a reference numeral 202 corresponds to the beam spot obtainedby the pulsed laser light irradiated to the semiconductor film 201. Thebeam spot 202 to the semiconductor film 201 is moved relatively to thedirection indicated by a white arrow by scanning the substrate 200 tothe direction indicated by an arrow of a continuous line.

Magnetic poles 203 a and 203 b correspond to the magnetic pole of amagnetic circuit that can apply the magnetic field to the semiconductorfilm 201, particularly in the region where the beam spot 202 isirradiated. The magnetic lines of force of the magnetic field generatedbetween the magnetic poles 203 a and 203 b are indicated by an arrow ofa dotted line. The magnetic poles 203 a and 203 b are provided on thesurface of the substrate 200 irradiated with the laser light. And thedirection of the magnetic lines of force exists in the surface of thesemiconductor film 201. In FIG. 3(A), the scanning direction of thesubstrate 200 is perpendicular to the direction of the magnetic lines offorce in the part of the semiconductor film 201 irradiated with the beamspot 202.

It is noted that the magnetic lines of force are distributed asconnecting the magnetic poles 203 a and 203 b. The magnetic lines offorce are almost straight in the space where the distance from themagnetic poles 203 a and 203 b is shorter, but are curved to have alarger curvature as the distance is longer. Therefore, the scanningdirection of the substrate 200 and the direction of the magnetic linesof force are not always perpendicular. In the present invention, it doesnot lead to any problems as long as the magnetic component in which thedirection of passing magnetic lines of force is almost constant isapplied in the part of the semiconductor film 201 irradiated with thebeam spot 202.

The magnetic flux density in the part of the semiconductor film 201irradiated with the beam spot 202 is set in the range of 1000 G to 10000G, preferably in the range of 1500 G to 4000 G.

And in this embodiment mode, as shown in FIG. 3(A), the direction of thepassing magnetic lines of force can be kept almost constant in the partof the semiconductor film 201 irradiated with the beam spot 202 bymaking the length Wb of the beam spot 202 in the direction of its majoraxis shorter than the distance W_(m2) between the magnetic poles 203 aand 203 b.

It is noted that the amount of the magnetic field can be controlled bythe width of W_(m2). It is preferable that W_(m2) ranges approximatelyfrom 1 mm to 5 mm.

In addition, although this embodiment mode explained the case in whichthe pulsed laser light is irradiated, the CW laser light may be alsoirradiated. FIG. 4(A) is a top view of the semiconductor film 201 in thecase where the CW laser light is irradiated, and FIG. 4(B) is across-sectional view taken along a dotted line A–A′ in FIG. 4(A). It isnoted that the same reference numerals as those in FIG. 3 are used inFIG. 4 in order to clarify the contrast with FIG. 3.

The different point between FIG. 3 and FIG. 4 is that a referencenumeral 202 corresponds to the beam spot obtained by the CW laser lightirradiated to the semiconductor film 201.

[Embodiment Mode 3]

This embodiment mode explains one mode of the present invention in whichthe magnetic field is applied to the direction different from those inFIG. 1 to FIG. 4.

FIG. 5(A) is a top view of the semiconductor film 301 and FIG. 5(B) is across-sectional view taken along a dotted line A–A′ in FIG. 5(A). It isnoted that a reference numeral 301 corresponds to a semiconductor filmformed over a substrate 300 in FIGS. 5(A) and 5(B).

The scanning direction of the substrate 300 exists in the substrate 300as indicated by an arrow of a continuous line. Moreover, a referencenumeral 302 corresponds to the beam spot obtained by the pulsed laserlight irradiated to the semiconductor film 301. The position of the beamspot 302 relatively to the semiconductor film 301 is moved to thedirection indicated by a white arrow by scanning the substrate 300 inthe direction indicated by an arrow of a continuous line.

The magnetic poles 303 a and 303 b correspond to the magnetic pole ofthe magnetic circuit that can apply the magnetic field to thesemiconductor film 301 particularly to the part irradiated with the beamspot 302. The magnetic lines of force of the magnetic field generatedbetween the magnetic poles 303 a and 303 b are indicated by an arrow ofa dotted line. The magnetic poles 303 a and 303 b are provided on thesurface of the substrate 300 irradiated with the laser light, and thedirection of the magnetic lines of force exists in the surface of thesemiconductor film 301. And in FIG. 5(A), the scanning direction of thesubstrate 300 is parallel to and is opposite to the direction of themagnetic lines of force in the part of the semiconductor film 301irradiated with the beam spot 302.

It is noted that the magnetic lines of force are distributed asconnecting the magnetic poles 303 a and 303 b. The magnetic lines offorce are almost straight in the space where the distance from themagnetic poles 303 a and 303 b is shorter, but are curved to have alarger curvature as the distance is longer. Therefore, the scanningdirection of the substrate 300 is not always parallel to the directionof the magnetic lines of force. In the present invention, it does notlead to any problems as long as the magnetic component in which thedirection of passing magnetic lines of force is almost constant isapplied in the part of the semiconductor film 301 irradiated with thebeam spot 302.

The magnetic flux density in the part of the semiconductor film 301irradiated with the beam spot 202 is set in the range of 1000 G to 10000G, preferably in the range of 1500 G to 4000 G.

And in this embodiment mode, as shown in FIG. 5(A), the direction ofpassing magnetic lines of force can be kept almost constant in the partof the semiconductor film 301 irradiated with the beam spot 302 bymaking the length Wb of the beam spot 302 in the direction of its majoraxis shorter than the distance W_(m3) between the magnetic poles 303 aand 303 b.

It is noted that the amount of the magnetic field can be controlled bythe width of W_(m30). It is preferable that W_(m30) ranges approximatelyfrom 1 mm to 5 mm.

It is noted that as the method for scanning laser light, there are anirradiation system moving type method in which a processing object,which is a substrate here, is fixed while an irradiated position oflaser light is moved, an object moving type method in which anirradiated position of the laser light is fixed while a substrate ismoved, and a method in which these two methods are combined.

The embodiment modes 1 to 3 explained the case in which the laserirradiation apparatus with the object moving type method employed butthe present invention is not limited to this. The present invention canbe applied to the laser irradiation apparatus with the irradiationsystem moving type employed and to the laser irradiation apparatus inwhich an object moving type and an irradiation system moving type arecombined. In any cases, it is premised that the relation between therelative moving direction of the beam spot to the semiconductor film andthe direction of the magnetic lines of force can be controlled.

In addition, although the embodiment modes 1 to 3 employ the magneticfield generated between the heterogeneous magnetic poles attracting eachother, the present invention is not limited to this. The magnetic fieldgenerated between the homogeneous magnetic poles repelling each othermay be also employed. For example, when the homogeneous magnetic polesare employed as the magnetic poles 203 a and 203 b in FIG. 3, themagnetic field can be applied in the direction perpendicular to thesemiconductor film 201.

It is noted that this embodiment mode explained the case where thepulsed laser light is irradiated but the CW laser light may be alsoirradiated. FIG. 6(A) is a top view of the semiconductor film 301 in thecase where the CW laser light is irradiated. FIG. 6(B) is across-sectional view taken along a dotted line A–A′ in FIG. 6(A). It isnoted that the same reference numerals as those in FIG. 5 are used inFIG. 6 in order to clarify the contrast with FIG. 5.

The different point between FIG. 5 and FIG. 6 is that a referencenumeral 302 corresponds to the beam spot obtained by the CW laser lightirradiated to the semiconductor film 301.

It is noted that the direction of the magnetic lines of force is notlimited to those indicated in the embodiment modes 1 to 3. The directionthereof may be opposite to those shown in FIG. 1 to FIG. 6, and it maybe determined to have an angle so as to be neither vertical nor parallelto both the scanning direction of the laser light and the semiconductorfilm.

[Embodiment Mode 4]

This embodiment mode explains the possible combination of the directionof the magnetic lines of force with the scanning direction of thesubstrate other than those in FIG. 1 to FIG. 6.

FIG. 7(A) shows an aspect where the pulsed laser light is irradiated toa semiconductor film 402 formed over a substrate 401. A referencenumeral 403 denotes a beam spot moving relatively to the directionindicated by a white arrow with respect to the semiconductor film 402.The direction of the magnetic lines of force is drawn by a dotted line.In FIG. 7(A), as well as in FIG. 1, the direction of the magnetic linesof force is perpendicular to the surface formed with the semiconductorfilm 402. The different point from FIG. 1 is that the direction of themagnetic lines of force is opposite to that in FIG. 1 so that themagnetic lines of force is directed to the surface of the substrate 401with the semiconductor film 402 formed thereon.

Next, FIG. 7(B) shows an aspect where a semiconductor film 412 formedover a substrate 411 is irradiated with the pulsed laser light. Areference numeral 413 is a beam spot moving relatively to the directionindicated by a white arrow with respect to the semiconductor film 412.The direction of the magnetic lines of force is drawn with a dottedline. In FIG. 7(B), as well as in FIG. 5, the direction of the magneticlines of force exists in the surface formed with the semiconductor film412, and is parallel to the moving direction of the beam spot 413. Thedifferent point from FIG. 5 is that the direction of the magnetic linesof force is opposite to that in FIG. 5 and that the magnetic lines offorce are directed oppositely to the moving direction of the beam spot413.

It is noted that FIG. 7 explained the case in which the pulsed laserlight is irradiated, but the CW laser light may be also irradiated. FIG.8(A) corresponds to the case in which the CW laser light is employed inFIG. 7(A). On the other hand, FIG. 8(B) corresponds to the case in whichthe CW laser light is employed in FIG. 7(B). In order to clarify thecontrast with FIG. 7(A), the same reference numerals as those in FIG.7(A) are used in FIG. 8(A). Moreover, in order to clarify the contrastwith FIG. 7(B), the same reference numerals as those in FIG. 7(B) areused in FIG. 8(B).

The different point between FIG. 7(A) and FIG. 8(A) is that a referencenumeral 403 in FIG. 8(A) corresponds to the beam spot obtained by the CWlaser light irradiated to the semiconductor film 402.

FIG. 8(C) shows an aspect where a semiconductor film 422 formed over asubstrate 421 is irradiated with the CW laser light. A reference numeral423 denotes a beam spot moving relatively to the direction indicated bya white arrow with respect to the semiconductor film 422. The directionof the magnetic lines of force is drawn with a dotted line. In FIG.8(C), as well as in FIG. 4(A), the direction of the magnetic lines offorce exists in the surface formed with the semiconductor film 422 andis perpendicular to the moving direction of the beam spot 423.

And in FIG. 8(C), after the beam spot is scanned to one direction, thebeam spot is moved to the direction perpendicular to the scanningdirection and then the laser light is scanned again to the samedirection. And by doing these operations in order, the whole surface ofthe substrate is irradiated with the laser light. In FIG. 8(C), themoving direction of the beam spot, that is after being irradiated to onedirection and that is before moving to the next scanning, is indicatedby an arrow of a continuous line.

In FIG. 8(C), the moving direction of the beam spot and the direction ofthe magnetic lines of force are corresponded.

Next, FIG. 8(D) shows an aspect in which a semiconductor film 432 formedover a substrate 431 is irradiated with the CW laser light. A referencenumeral 433 denotes a beam spot moving to the direction indicated by awhite arrow relatively to the semiconductor film 432. The direction ofthe magnetic lines of force is drawn by a dotted line. In FIG. 8(D), aswell as in the case of FIG. 4(A), the direction of the magnetic lines offorce exists in the surface formed with the semiconductor film 432 andis perpendicular to the moving direction of the beam spot 433.

And in FIG. 8(D), after the beam spot is scanned to one direction, thebeam spot is moved to the direction perpendicular to the scanningdirection and then the laser light is scanned again to the samedirection. And by doing these operations in order, the whole surface ofthe substrate is irradiated with the laser light. In FIG. 8(D), themoving direction of the beam spot, which is after being irradiated toone direction and that is before moving to the next scanning, isindicated by an arrow of a continuous line.

In FIG. 8(D), the moving direction of the beam spot is opposite to thedirection of the magnetic lines of force.

[Embodiment Mode 5]

This embodiment mode specifically explains a method for crystallizingthe semiconductor film using the laser irradiation apparatus of thepresent invention.

First, as shown in FIG. 9(A), a base film 501 is formed on a substrate500. As the substrate 500, a glass substrate such as a bariumborosilicate glass and an alumino-borosilicate glass, a quartzsubstrate, an SUS substrate, or the like can be used. Moreover, althougha substrate made from flexible synthetic resin such as plastic tends tobe inferior in heat resistance to the substrate 500, it can be used aslong as it can be resistant against the processing heat generated in themanufacturing process.

The base film 501 is provided so that alkaline metal such as Na oralkaline-earth metal included in the substrate 500 may not diffuse intothe semiconductor film to have an adverse affect on a characteristic ofa semiconductor element. Therefore, the base film 501 is formed of aninsulating film such as silicon oxide, silicon nitride, or siliconnitride oxide, which can suppress the diffusion of the alkaline metal orthe alkaline-earth metal into the semiconductor film. In this embodimentmode, a silicon nitride oxide film is formed in thickness ranging from10 nm to 400 nm (preferably from 50 nm to 300 nm) by plasma-CVD method.

It is noted that the base film 501 may be formed in single layer or inlaminated layer of a plurality of insulating films or the like. In thecase to use the substrate including the alkaline metal or thealkaline-earth metal in any way such as a glass substrate, an SUSsubstrate, or a plastic substrate, it is effective to provide the basefilm in order to prevent the diffusion of the impurities. On the otherhand, when the diffusion of impurities in the substrate such as a quartzsubstrate does not lead to any significant problems, the base film doesnot always have to be provided.

Next, a semiconductor film 502 is formed on the base film 501. Thethickness of the semiconductor film 502 is set in the range of 25 nm to100 nm (preferably in the range of 30 nm to 60 nm). It is noted that thesemiconductor film 502 may be amorphous semiconductor orpoly-crystalline semiconductor Moreover, not only silicon but alsosilicon germanium can be used as the semiconductor. When silicongermanium is used, it is preferable that the concentration of germaniumis approximately in the range of 0.01 atomic % to 4.5 atomic %.

Next, the zeroth element is added to the semiconductor film 502 by anion dope method (ion doping method). This embodiment mode explains anexample with Ar used as the zeroth element. For example, in the case ofAr, Ar is added so that the concentration in the semiconductor filmranges from 1×10¹⁸ atoms/cm³ to 1×10²¹ atoms/cm³, preferably from 5×10¹⁸atoms/cm³ to 5×10²⁰ atoms/cm³. And the accelerating voltage affects theconcentration distribution of Ar in the direction of the thickness ofthe semiconductor film 502. Therefore, the acceleration voltage isdetermined appropriately by the condition in which the concentration ismade higher toward the surface side of the film, the concentration ismade higher toward the substrate side of the film, or the concentrationis made uniform all over the film. In this embodiment mode, theaccelerating voltage was set to 30 kV.

It is noted that the laser light may be irradiated in the atmosphere ofthe gas with hydrogen added to the zeroth element. In this case, thepartial pressure of hydrogen is set in the range of 1% to 3%.

Next, as shown in FIG. 9(B), the semiconductor film 502 is crystallizedwith the laser irradiation apparatus of the present invention. In thisembodiment mode, the pulsed excimer laser, YAG laser, YVO₄ laser, or thelike is used. When the YAG laser is used for example, a wavelength ofthe second harmonic, which is easy to be absorbed in the semiconductorfilm, is used. And the oscillation frequency is set in the range of 30kHz to 300 kHz, and the energy density is set in the range of 300 mJ/cm²to 600 mJ/cm² (typically in the range of 350 mJ/cm² to 500 mJ/cm²) andthe scanning speed may be set so as to irradiate every several shots onany point.

When the CW laser light is irradiated, a large grain crystal can beobtained by using a solid laser and by using the second harmonic to thefourth harmonic of the fundamental wave. For example, it is desirable touse the second harmonic (532 nm) or the third harmonic (355 nm) emittedfrom Nd: YVO₄ laser (fundamental wave 1064 nm) typically. Specifically,the laser light emitted from a CW YVO₄ laser is converted into theharmonic through non-linear optical element and the laser light with anoutput of 10 W is obtained. In addition, the harmonic can be alsoemitted by inserting YVO₄ crystal and non-linear optical element in theresonator. And it is preferable that the laser light is shaped intorectangular or elliptical on the surface to be irradiated through anoptical system and that the semiconductor film 502 is irradiated withthe shaped laser light. The energy density here is required in the rangeof 0.01 MW/cm₂ to 100 MW/cm² (preferably in the range of 0.1 MW/cm² to10 MW/cm²). And the laser light is irradiated as moving the amorphoussemiconductor film 502 relatively to the laser light at a speed rangingfrom 10 cm/s to 2000 cm/s.

And in the present invention, the magnetic field is applied withmagnetic poles 504 and 505 to the region irradiated with the laserlight. In this embodiment mode, the scanning direction of the laserlight and the direction of the magnetic lines of force are corresponded.In FIG. 9(B), the moving direction of the laser light relative to thesubstrate 500 is shown with a white arrow while the direction of themagnetic lines of force is shown with an arrow of a dotted line.

It is noted that the magnetic lines of force are distributed asconnecting the magnetic poles 504 and 505. The magnetic lines of forceare almost straight in the space where the distance from the magneticpoles 504 and 505 is shorter, but are curved to have a larger curvatureas the distance is longer. Therefore, the moving direction of the beamspot is not always parallel to the direction of the magnetic lines offorce. In the present invention, it does not lead to any problems aslong as the magnetic component in which the direction of passingmagnetic lines of force is almost constant is applied in the part 506 ofthe semiconductor film 502 irradiated with the beam spot.

The magnetic flux density in the region 506 irradiated with the beamspot is in the range of 1000 G to 10000 G, preferably in the range of1500 G to 4000 G

The laser light is irradiated in the atmosphere including the gas of thezeroth element for 99.99% or more, preferably 99.9999% or more, in theload lock system chamber. In this embodiment mode, Ar is used as thezeroth element.

It is noted that the zeroth element that is doped and the zeroth elementthat is used when the laser light is irradiated do not always have to bethe same.

The semiconductor film 503 having further enhanced crystallinity isformed by irradiating the semiconductor film 502 with the laser light asdescribed above.

Next, as shown in FIG. 9(C), the semiconductor film 503 is patterned toform island shaped semiconductor films 507 to 509 and various kinds ofsemiconductor elements, typically TFT, are formed using these islandshaped semiconductor films 507 to 509.

When TFT is manufactured, for example, a gate insulating film is formedso as to cover the island shaped semiconductor films 507 to 509. As thegate insulating film, silicon oxide, silicon nitride, silicon nitrideoxide, or the like can be used. The gate insulating film can be formedby the plasma-CVD method, the sputtering method, or the like.

Next, a gate electrode is formed by forming a conductive film on thegate insulating film and patterning the conductive film. And the gateelectrode or resist being formed and patterned is used as a mask, andthe impurities imparting n-type or p-type conductivity are added to theisland shaped semiconductor films 507 to 509 to form a source region, adrain region, furthermore an LDD region, and the like.

TFT can be formed through such a series of processes. It is noted thatthe method for manufacturing the semiconductor device in the presentinvention is not limited to the process for manufacturing TFT describedabove following after forming the island shaped semiconductor films. Thevariation of the on-current, the threshold, and the mobility between theelements can be suppressed when the semiconductor film crystallized withthe laser irradiation method according to the present invention isemployed as an active layer of TFT.

[Embodiment Mode 6]

Unlike the embodiment mode 5, this embodiment mode explains an examplein which the crystallization method by the laser irradiation apparatusof the present invention is combined with a crystallization method bythe catalyst element.

First, the processes from forming the semiconductor film 502 up todoping the semiconductor film 502 with the zeroth element are performedin reference to FIG. 9(A) in the embodiment mode 5. Next, as shown inFIG. 10(A), the surface of the semiconductor film 502 is applied withnickel acetate solution including Ni in the range of 1 ppm to 100 ppm inweight with spin coating method. It is noted that the catalyst may beadded not only by the spin coating method but also by the sputteringmethod, the vapor deposition method, the plasma process, or the like.

Next, a heating process was performed for 4 hours to 24 hours, at atemperature ranging from 500° C. to 650° C., for example for 14 hours ata temperature of 570° C. This heating process forms the semiconductorfilm 502 in which the crystallization is promoted in the verticaldirection toward the substrate 500 from the surface with nickel acetatesolution applied thereon. (FIG. 10(A))

It is noted that in this embodiment mode nickel (Ni) is used as thecatalyst element, but the other element such as germanium (Ge), Ferrum(Fe), Palladium (Pd), Tin (Sn), Lead (Pb), Cobalt (Co), Platinum (Pt),Copper (Cu), or Gold (Au) may be also used.

Next, as shown in FIG. 10(B), the semiconductor film 520 is crystallizedwith the laser irradiation apparatus of the present invention to form asemiconductor film 521. In this embodiment mode, a pulsed excimer laser,YAG laser, YVO₄ laser, or the like is used. When the YAG laser is usedfor example, a second harmonic that is easy to be absorbed in thesemiconductor film is used. And the oscillation frequency is set in therange of 30 kHz to 300 kHz, and the energy density is set in the rangeof 300 mJ/cm² to 600 mJ/cm² (typically in the range of 350 mJ/cm² to 500mJ/cm²) and the scanning speed is set so as to be able to irradiateevery several shots on any point.

In addition, when a CW YVO₄ laser is used, for example, the laser lightis shaped into rectangular or elliptical on the surface to be irradiatedand the semiconductor film 520 is irradiated with the shaped laserlight. The energy density is necessary in the range of 0.01 MW/cm² to100 MW/cm² (preferably in the range of 0.1 MW/cm² to 10 MW/cm²). And thesemiconductor film 520 is irradiated with the laser light by moving thesemiconductor film 520 relatively to the laser light at a speed rangingfrom 10 cm/s to 2000 cm/s.

And in the present invention, the magnetic field is applied to theregion irradiated by the laser light with a magnetic pole 527 from theside of the substrate 500 opposite to the side of the substrate 500 withthe semiconductor film 520 formed thereon. In this embodiment mode, boththe scanning direction of the laser light and the surface formed withthe semiconductor film 520 are made perpendicular to the direction ofthe magnetic lines of force in the magnetic field. In FIG. 10(B), themoving direction of the laser light relative to the substrate 500 isdrawn with a white arrow, while the direction of the magnetic lines offorce is drawn with an arrow of a dotted line.

It is noted that the surface with the semiconductor film 520 formed isnot necessarily perpendicular to the direction of the magnetic lines offorce. In the present invention, it does not lead to any problems aslong as the magnetic component where the direction of passing magneticlines of force is almost constant is applied in the part 528 of thesemiconductor film 520 irradiated with a beam spot.

And the magnetic flux density in the part 528 irradiated with the beamspot is set in the range of 1000 G to 10000 G, preferably in the rangeof 1500 G to 4000 G.

The laser light is irradiated in the atmosphere including the zerothelement gas for 99.99% or more, preferably 99.9999% or more, in the loadlock system chamber. In this embodiment mode, Ar is used as the zerothelement.

It is noted that the zeroth element that is doped and the zeroth elementthat is used when the laser light is irradiated do not always have to bethe same.

The semiconductor film 521 whose crystallinity is further enhanced isformed by irradiating the semiconductor film 520 with the laser light asdescribed above.

It is noted that the catalyst element (Ni here) is supposed to beincluded at a concentration of approximately 1×10¹⁹ atoms/cm³ inside thesemiconductor film 521 that is crystallized with the catalyst element asshown in FIG. 10(B). Next, the catalyst element existing in thesemiconductor film 521 is gettered.

First, an oxide film 522 is formed over the surface of the semiconductorfilm 521 as shown in FIG. 10(C). By forming the oxide film 522 having athickness ranging from 1 nm to 10 nm, the surface of the semiconductorfilm 521 can be prevented from becoming rough in the following etchingprocess.

The oxide film 522 can be formed by the known method. For example, theoxide film 522 may be formed by oxidizing the surface of thesemiconductor film 521 with ozone water or with the solution in whichhydrogen peroxide solution is mixed with sulfuric acid, hydrochloricacid, nitric acid, or the like. Alternatively, the oxide film 522 may beformed by the plasma process, heating process, ultraviolet rayirradiation, or the like in the atmosphere including oxygen. Moreover,the oxide film 522 may be formed by the plasma-CVD method, thesputtering method, the vapor deposition method, or the like.

A semiconductor film 523 for the gettering including the noble gaselement not less than 1×10²⁰ atoms/cm³ is formed in thickness from 25 nmto 250 nm on the oxide film 522 by the sputtering method. It isdesirable that the mass density of the semiconductor film 523 for thegettering is lower than that of the semiconductor film 521 in order toincrease the selecting ratio to the semiconductor film 521 when beingetched.

As the noble gas element, one kind or plural kinds selected from thegroup consisting of Helium (He), Neon (Ne), Argon (Ar), Krypton (Kr),and Xenon (Xe) are used.

Next the gettering is performed through the heating process with thefurnace annealing method or the RTA method. When the furnace annealingmethod is employed, the heating process is performed for 0.5 hours to 12hours at a temperature ranging from 450° C. to 600° C. in the atmosphereof nitrogen. When the RTA method is employed, a lamp light source forheating is turned on for 1 to 60 seconds, preferably in the range of 30seconds to 60 seconds, which is repeated from 1 time to 10 times,preferably from 2 times to 6 times. The lamp light source may have anyluminance intensity, but the luminance intensity is set so that thesemiconductor film is heated instantaneously at a temperature rangingfrom 600° C. to 1000° C., preferably from 700° C. to 750° C.

Through the heating process, the catalyst element inside thesemiconductor film 521 is moved to the semiconductor film 523 for thegettering due to the diffusion as indicated by an arrow, and thecatalyst element is thus gettered.

Next, the semiconductor film 523 for the gettering is removed by etchingselectively. The etching process is performed by dry etching with ClF₃not applying plasma, or by wet etching with alkali solution such as thesolution including hydrazine or tetraethylammonium hydroxide (chemicalformula (CH₃)₄NOH). On this occasion, the oxide film 522 prevents theoxide film 521 from being etched.

Next, the oxide film 522 is removed by hydrofluoric acid.

Next, the semiconductor film 521 after removing the oxide film 522 ispatterned to form the island shaped semiconductor films 524 to 526.(FIG. 10(D))

It is noted that the gettering process in the present invention is notlimited to the method described in this embodiment mode. The catalystelement in the semiconductor film may be reduced with the other method.

Next, various semiconductor elements, typically TFT, are formed usingthese island shaped semiconductor films 524 to 526.

It is noted that the crystallinity of the semiconductor film can be moreenhanced compared with the case in the embodiment mode 5 bycrystallizing the semiconductor film with the irradiation of the laserlight after crystallizing it with the catalyst element as described inthis embodiment mode. In the embodiment mode 5, the crystallization ispromoted in such a way that crystal nucleus arises randomly after beingirradiated with the laser light. On the other hand, in this embodimentmode, the crystal formed in the crystallization by the catalyst elementstays as it is without being melted by the irradiation of the laserlight in the side closer to the substrate and the crystallization ispromoted by having the crystal as its crystal nucleus. As a result, thecrystallization by the irradiation of the laser light is easy to bepromoted from the substrate side to the surface uniformly, and thus thesurface is prevented from becoming rough compared with the case of theembodiment mode 5. Therefore, the variation of the characteristic of thesemiconductor element formed afterward, typically TFT, can be moresuppressed.

It is noted that this embodiment mode explained the process to promotecrystallization by performing the heating process after the catalystelement is added, and to further enhance crystallinity by irradiatingthe laser light. However, the present invention is not limited to this,and the heating process may be omitted. Specifically, after adding thecatalyst element, the laser light may be irradiated instead of theheating process in order to enhance the crystallinity.

[Embodiment Mode 7]

This embodiment mode, unlike the embodiment mode 6, explains an examplein which the crystallizing method with the laser irradiation apparatusaccording to this invention is combined with the crystallizing methodwith the catalyst element.

Initially, the processes from forming the semiconductor film 502 up todoping the zeroth element to the semiconductor film 502 are performedwith reference to FIG. 9(A) in the embodiment mode 5. Next, as shown inFIG. 11(A), a mask 540 having an opening is formed on the semiconductorfilm 502. And the nickel acetate solution including Ni in the range of 1ppm to 100 ppm in weight is applied to the surface of the semiconductorfilm 502 by the spin coating method. It is noted that the method foradding the catalyst element is not limited to this, and the sputteringmethod, the vapor deposition method, the plasma process, or the like canbe also employed. Applied nickel acetate solution contacts thesemiconductor film 502 in the opening of the mask 504. (FIG. 11(A))

Next, the heating process is performed for 4 hours to 24 hours at atemperature ranging from 500° C. to 650° C., for example for 14 hours ata temperature of 570° C. This heating process forms a semiconductor film530 in which the crystallization is promoted from the surface with thenickel acetate solution applied thereon as indicated by an arrow of acontinuous line. (FIG. 11(A))

It is noted that the catalyst element cited in the embodiment mode 6 canbe used as the catalyst element.

Next, after the mask 540 is removed, the semiconductor film 530 iscrystallized with the laser irradiation apparatus of the presentinvention as shown in FIG. 11(B). In this embodiment mode, a pulsedexcimer laser, YAG laser, YVO₄ laser or the like can be used. When theYAG laser is used for example, a second harmonic, which is easy to beabsorbed in the semiconductor film, is used. And the oscillationfrequency is set in the range of 30 kHz to 300 kHz, and the energydensity is set in the range of 300 mJ/cm² to 600 mJ/cm² (typically inthe range of 350 mJ/cm² to 500 mJ/cm²) and the scanning speed may be setso as to be able to irradiate every several shots on any point.

For example, when the CW YVO₄ laser is employed, the laser light isshaped into rectangular or elliptical on the surface to be irradiatedand the semiconductor film 530 is irradiated with the shaped laserlight. The energy density is required in the range of approximately 0.01MW/cm² to 100 MW/cm² (preferably in the range of 0.1 MW/cm² to 10MW/cm²). And the laser light is irradiated as moving the amorphoussemiconductor film 530 relatively to the laser light at a speed rangingfrom 10 cm/s to 2000 cm/s.

And in the present invention, the magnetic field is applied withmagnetic poles 541 and 542 to the region irradiated with the laserlight. In this embodiment mode, the scanning direction of the laserlight and the direction of the magnetic lines of force are corresponded.In FIG. 11(B), the moving direction of the laser light relative to thesubstrate 500 is shown with a white arrow while the direction of themagnetic lines of force is shown with an arrow of a dotted line.

It is noted that the magnetic lines of force are distributed asconnecting the magnetic poles 541 and 542. The magnetic lines of forceare almost straight in the space where the distance from the magneticpoles 541 and 542 is shorter, but are curved to have a larger curvatureas the distance is longer. Therefore, the moving direction of the beamspot is not always parallel to the direction of the magnetic lines offorce. In the present invention, it does not lead to any problems aslong as the magnetic component in which the direction of passingmagnetic lines of force is almost constant is applied in the part 538 ofthe semiconductor film 530 irradiated with the beam spot.

The magnetic flux density in the region 538 irradiated with the beamspot is set in the range of 1000 G to 10000 G, preferably in the rangeof 1500 G to 4000 G.

The laser light is irradiated in the atmosphere including the zerothelement gas for 99.99% or more, preferably 99.9999% or more, in the loadlock system chamber. In this embodiment mode, Ar is used as the zerothelement.

It is noted that the zeroth element that is doped and the zeroth elementthat is used when the laser light is irradiated do not always have to bethe same.

A semiconductor film 531 having further enhanced crystallinity is formedby irradiating the semiconductor film 530 with the laser light asdescribed above.

It is noted that the semiconductor film 531 crystallized with thecatalyst element is supposed to include the catalyst element (Ni here)as shown in FIG. 11(B) at a concentration of approximately 1×10¹⁹atoms/cm³. Sequentially the catalyst element existing in thesemiconductor film 531 is gettered.

As shown in FIG. 11(C), a silicon oxide film 532 for a mask is formed150 nm in thickness so as to cover the semiconductor film 531. And thenan opening is provided by patterning the silicon oxide film 532 in orderto expose a part of the semiconductor film 531. Then, phosphorous isadded to provide a region 533 in which phosphorous is added in thesemiconductor film 531.

When the heating process is performed in this state for 5 hours to 24hours at a temperature ranging from 550° C. to 800° C. in the atmosphereof nitrogen, for example for 12 hours at a temperature of 600° C., theregion 533 with phosphorous added in the semiconductor film 531 works asa gettering site. As a result, the catalyst element left in thesemiconductor film 531 is moved in the gettering region 533 withphosphorous added therein. (FIG. 11(C))

And the concentration of the catalyst element in the rest of the regionsin the semiconductor film 530 can be decreased to 1×10¹⁷ atms/cm³ orless by removing the region 533 with phosphorous added therein by meansof etching.

After removing the silicon oxide film 532 for the mask, thesemiconductor film 531 is patterned to form island shaped semiconductorfilms 534 to 536. (FIG. 11(D))

It is noted that the gettering process in the present invention is notlimited to the method shown in this embodiment mode. The other methodmay be employed in order to decrease the catalyst element in thesemiconductor film.

Next, various kinds of semiconductor elements, typically TFT, are formedusing the island shaped semiconductor films 534 to 536.

It is noted that the crystallinity of the semiconductor film can be moreenhanced compared with the case of the embodiment mode 5, bycrystallizing the semiconductor film with the irradiation of the laserlight after crystallizing it with the catalyst element as described inthis embodiment mode. In the embodiment mode 5, the crystallization ispromoted in such a way that crystal nucleus arises randomly after beingirradiated with the laser light. On the other hand, in this embodimentmode, the crystal formed in the crystallization by the catalyst elementstays as it is without being melted by the irradiation of the laserlight in the side closer to the substrate and the crystallization ispromoted by having the crystal as its crystal nucleus. As a result, thecrystallization by the irradiation of the laser light is easy to bepromoted from the substrate side to the surface uniformly, and thus thesurface is prevented from becoming rough compared with the case in theembodiment mode 5. Therefore, the variation of the characteristic of thesemiconductor element formed afterward, typically TFT, can be moresuppressed.

It is noted that this embodiment mode explained the structure to promotethe crystallization by performing the heating process after the catalystelement is added, and to further enhance crystallinity by theirradiation of the laser light. However, the present invention is notlimited to this, and the heating process may be omitted. Specifically,after adding the catalyst element, the laser light may be irradiatedinstead of the heating process in order to enhance the crystallinity.

[Embodiment Mode 8]

This embodiment explains the structure of the pulsed laser irradiationapparatus including the load lock system chamber.

FIG. 12 shows the structure of the laser irradiation apparatus in thisembodiment mode. A laser irradiation chamber 1206 is surrounded by abarrier diffusion 1230. It is noted that since the laser light is highlydirectional and has the high energy density, it is preferable that thebarrier diffusion 1230 has the characteristic of absorbing the reflectedlight in order to prevent the reflected light from irradiating aninappropriate region. In addition, cooling water may be circulated inthe barrier diffusion in order to prevent the rise of the temperaturedue to the absorption of the reflected light.

Moreover, as shown in FIG. 12, means 1240 for heating the barrierdiffusion (barrier diffusion heating means) may be provided to heat thebarrier diffusion when the laser irradiation chamber is evacuated.

And a gate 1210 corresponds to a transferring gate for transferring thesubstrate to the laser irradiation chamber 1206. The gas inside thelaser irradiation chamber 1206 can be evacuated by an evacuation system1231 connected to an evacuation port 1211. The noble gas can be suppliedinto the laser irradiation chamber 1206 by a noble gas supplying system1250 connected to a supply port 1251.

A reference numeral 1212 denotes a stage on which the substrate 1203 ismounted. The position of the substrate 1203 can be controlled by movingthe stage according to position controlling means 1242 and thus theirradiation position of the laser light can be moved. As shown in FIG.12, means 1241 for heating the substrate (substrate heating means) maybe provided in the stage 1212.

An opening 1232 provided in the barrier diffusion 1230 is covered by awindow 1233 to transmit the laser light (transmission window). It ispreferable that the transmission window is made of the material that ishard to absorb the laser light. For example the quarts or the like isappropriate. A gasket 1236 is provided between the transmission window1233 and the barrier diffusion 1230. The gasket 1236 can prevent theatmosphere from entering the laser irradiation chamber from the spacebetween the transmission window 1233 and the barrier diffusion 1230.

Initially, the substrate 1203 with the semiconductor film formed thereonis transferred. After the gate 1210 is closed, the laser irradiationchamber 1206 is kept with the atmosphere of the noble gas by using theevacuation system 1231 and the noble gas supplying system 1250.

The beam spot of the laser light oscillated from the laser oscillator1213 is shaped through an optical system 1214 and the substrate 1203 isirradiated with the shaped beam spot. The incidence angle θ ispreferably set more than 0°, more preferably in the range of 5° to 30°,in order to prevent the return light and to perform the uniformirradiation.

A reference numeral 1252 denotes the magnetic pole of the magneticcircuit, which applies the magnetic field to the semiconductor filmformed over the substrate 1203. It is noted that though the magneticfield is applied from the side of the substrate 1203 irradiated with thelaser light, the present invention is not limited to this. The magneticfield may be applied from the side of the substrate 1203 opposite to theside thereof irradiated with the laser light by incorporating themagnetic pole 1252 into the stage 1212.

It is noted that the laser irradiation chamber 1206 shown in FIG. 12 maybe one chamber included in the multi-chambers. When the chamber fordoping the noble gas element to the semiconductor film is provided sothat a series of the processes from doping the noble gas element up tocrystallizing with the laser light are performed in the multi-chamberwithout exposing it to the air, it is possible to prevent the impuritiesfrom mixing into the semiconductor film more effectively.

It is noted that when the laser irradiation apparatus is employed forcrystallizing the semiconductor film, it is possible to make thecrystallinity of the semiconductor film more uniform. The method formanufacturing the semiconductor device in the present invention can beapplied to manufacture the integrated circuit and the semiconductordisplay device. Particularly, when the present invention is applied tothe semiconductor element such as the transistor provided in the pixelportion of the semiconductor display device such as the liquid crystaldisplay device, the light-emitting device having the light-emittingelement typified by the organic light-emitting element equipped in eachpixel, DMD (Digital Micromirror Device), PDP (Plasma Display Panel), orFED (Field Emission Display), it is possible to prevent the horizontalstripes from being visible due to the energy distribution of the laserlight irradiated to the pixel portion thereof.

It is noted that FIG. 12 shows the pulsed laser irradiation apparatus,but a CW laser irradiation apparatus may be also applicable in thisembodiment mode. FIG. 13 shows the CW laser irradiation apparatus inthis embodiment mode. The same reference numerals as those in FIG. 12are used, but the structure of the optical system 1214 is different inFIG. 12 and in FIG. 13.

[Embodiment Mode 9]

One mode of the laser irradiation apparatus of the present invention isexplained.

FIG. 14 shows a structure of the laser irradiation apparatus of thisembodiment mode. Laser light oscillated from a laser oscillationapparatus 1500 is changed into linearly-polarized light through apolarizer 1507, and then is incident into a beam expander 1508. On theother hand, laser light oscillated from a laser oscillation apparatus1501 is changed into linearly-polarized light through a polarizer 1504and then is changed in its polarization angle by 90° through a waveplate 1506. Then, the laser light is incident into the beam expander1508 together with the laser light oscillated from the laser oscillationapparatus 1500 by the use of the polarizer 1507.

It is noted that this embodiment mode employs a shutter 1502 forshutting out the laser light provided between the laser oscillationapparatus 1500 and the polarizer 1507, but the shutter does not alwayshave to be provided. Moreover, a shutter 1503 for shutting out the laserlight is provided between the laser oscillation apparatus 1501 and thepolarizer 1504, but the shutter does not always have to be provided.

The beam expander 1508 can suppress the divergence of the incident laserlight and adjust the size of the beam spot.

The laser light emitted from the beam expander 1508 is converged througha cylindrical lens 1509 so that the beam spot thereof becomesrectangular, elliptical, or linear. The converged laser light isreflected by a mirror 1510 and then is incident into a lens 1511. Theincident laser light is converged again through the lens 1511 and isirradiated to a substrate 1514 in a laser irradiation chamber 1513. Thisembodiment mode employed an f θ telecentric lens as the lens 1511.

In this embodiment mode, the optical system includes the polarizers 1504and 1507, the beam expander 1508, a wave plate 1506, the shutters 1502and 1503, the cylindrical lens 1509, the mirror 1510, and the lens 1511.

In the laser irradiation chamber 1513, the substrate 1514 is mounted ona stage 1515 controlled by three position controlling means 1516 to1518. Specifically, the position controlling means for φ direction 1516can rotate the stage 1515 in the horizontal plane. In addition, theposition controlling means for X direction 1517 can move the stage 1515to X direction in the horizontal plane. Furthermore, the positioncontrolling means for Y direction 1518 can move the stage 1515 to Ydirection in the horizontal plane. These position controlling means arecontrolled with a central processing apparatus 1519.

A reference numeral 1520 denotes a magnetic pole included in themagnetic circuit, which can apply a magnetic field to the semiconductorfilm formed over the substrate 1514. It is noted that though themagnetic field is applied from the side of the substrate 1514 irradiatedwith the laser light in this embodiment mode, the present invention isnot limited to this. This magnetic pole 1520 may be incorporated in thestage 1515 so that the magnetic field is applied from the side of thesubstrate 1514 opposite to the side thereof irradiated with the laserlight.

It is noted that a monitor 1512 using light-sensitive element such asCCD may be provided to know the exact position of the substrate asdescribed in this embodiment mode.

It is noted that though FIG. 14 shows the pulsed laser irradiationapparatus, the CW laser irradiation apparatus may be employed as thelaser irradiation apparatus of the present invention. FIG. 15 shows theCW laser irradiation apparatus in this embodiment mode. The samereference numerals as those in FIG. 14 are used in FIG. 15 though thelens 1511 to be used is different in FIG. 14 and FIG. 15. The angle ofthe mirror 1510 in FIG. 14 is changeable while the mirror 1510 in FIG.15 is fixed.

[Embodiment Mode 10]

This embodiment mode explains the optical system included in the laserirradiation apparatus of the present invention.

FIG. 16(A) shows the optical system in this embodiment mode, which isused in pulse oscillation and in CW oscillation. The optical systemshown in FIG. 16(A) has two cylindrical lenses 701 and 702. The beamspot of the laser light being incident from the direction indicated byan arrow is shaped through the two cylindrical lenses 701 and 702, andthen the shaped beam spot is irradiated to the processing object 703. Itis noted that the cylindrical lens 702 positioned closer to theprocessing object 703 has a shorter focal length than the cylindricallens 701. In order to avoid the return light and to perform uniformirradiation, the incidence angle of the laser light to the processingobject 703 is set to be more than 0°, preferably in the range of 5° to30°.

FIG. 16(B) shows the optical system in this embodiment mode, which isused in pulse oscillation and in CW oscillation. The optical systemshown in FIG. 16(B) includes a mirror 705 and a planoconvex sphericallens 706. After the laser light being incident from the directionindicated by an arrow is reflected on the mirror 705, its beam spot isshaped through the planoconvex spherical lens 706, and then the shapedbeam spot is irradiated to a processing object 707. It is noted that adesigner can determine the radius of curvature of the planoconvexspherical lens appropriately. In addition, in order to avoid the returnlight and to perform uniform irradiation, the incidence angle of thelaser light to the processing object 707 is set to be more than 0°,preferably in the range of 5° to 30°.

FIG. 16(C) shows the optical system in this embodiment mode, which isused in pulse oscillation and in CW oscillation. The optical systemshown in FIG. 16(C) includes mirrors 710, 711, lenses 712,713, and 714.After the laser light being incident from the direction indicated by anarrow is reflected on the mirrors 710 and 711, its beam spot is shapedthrough the lenses 712, 713, and 714, and then the shaped beam spot isirradiated to a processing object 715. It is noted that in order toavoid the return light and to perform uniform irradiation, the incidenceangle of the laser light to the processing object 715 is set to be morethan 0°, preferably in the range of 5° to 30°.

FIG. 16(D) shows the optical system in this embodiment mode, which isused in CW oscillation. The optical system shown in FIG. 16(D) is theoptical system for combining four beam spots to form one beam spot. Theoptical system shown in FIG. 16(D) includes six cylindrical lenses 717to 722. Four of the laser light being incident from the directionindicated by an arrow are incident into four cylindrical lenses 719 to722 respectively. The two beam spots of the laser light shaped throughthe cylindrical lenses 719 and 721 are shaped again through thecylindrical lens 717 and then the shaped beam spot is irradiated to theprocessing object 723. On the other hand, the other two beam spots ofthe laser light shaped through the cylindrical lenses 720 and 722 areshaped again through the cylindrical lens 718, and then the shaped beamspot is irradiated to the processing object 723.

Each beam spot of the laser light on the processing object 723 iscombined so as to form one beam spot by overlapping each otherpartially.

It is possible for a designer to determine the focal length of each lensand the incidence angle appropriately. However, the focal length of thecylindrical lenses 717 and 718, which are positioned closest to theprocessing object 723, are made shorter than that of the cylindricallenses 719 to 722. For example, the focal length of the cylindricallenses 717 and 718, which are positioned closest to the processingobject 723, is set to be 20 mm. And the focal length of the cylindricallenses 719 to 722 is set to be 150 mm. Each lens is arranged so that theincidence angle of the laser light from the cylindrical lenses 717 and718 to the processing object 723 is 25° and the incidence angle of thelaser light from the cylindrical lenses 719 to 722 to the cylindricallenses 717 and 718 is 10° in this embodiment. It is noted that in orderto avoid the return light and to perform uniform irradiation, theincidence angle of the laser light to the processing object 723 is setto be more than 0°, preferably in the range of 5° to 30°.

FIG. 16(D) shows an example to combine four beam spots. In this case,there are four cylindrical lenses provided to correspond with four laseroscillators, and there are two cylindrical lenses provided to correspondwith the four cylindrical lenses. The number of beam spots to becombined is not limited to this, and the number thereof may be no fewerthan 2, nor more than 8. When n (n=2,4,6,8) number of the beam spots arecombined, n number of the cylindrical lenses are provided to correspondwith n number of the laser oscillators respectively, and n/2 number ofthe cylindrical lenses are provided to correspond with n number of thecylindrical lenses. When n (n=3,5,7) number of the beam spots arecombined, n number of the cylindrical lenses are provided to correspondwith n number of the laser oscillators respectively, and (n+1)/2 numberof the cylindrical lenses are provided to correspond with n number ofthe cylindrical lenses.

When five or more of the beam spots are overlapped, it is desirable thatthe fifth and subsequent laser light is irradiated from the side of therear surface of the substrate in consideration of the position of theoptical system, interference, and the like. Moreover, the substrateneeds to be transparent.

It is desirable that an incidence angle θ of the laser light satisfiesthe inequality of θ≧arctan (W/2d). In the inequality, it is defined thatan incidence plane is perpendicular to the surface to be irradiated andis including a longer side or a shorter side of the beam spot assumingthat the beam spot is rectangular in shape. Moreover, in the inequality,“W” is a length of the longer side or the shorter side included in theincidence plane and “d” is a thickness of the substrate transparent tothe laser light, which is placed at the surface to be irradiated. It isdefined that a track of the laser light projected to the incidence planehas an incidence angle θ when the track is not on the incidence plane.When the laser beam is made incident at an angle θ, it is possible toperform uniform irradiation of the laser beam without interference ofreflected light from a surface of the substrate with reflected lightfrom a rear surface of the substrate. The theory above is consideredassuming that a refractive index of the substrate is 1. In fact, thesubstrate has a refractive index of 1.5 approximately, and a largervalue than the angle calculated in accordance with the above theory isobtained when the value around 1.5 is taken into account. However, sincethe laser beam on the surface to be irradiated has energy attenuated atopposite sides in the longitudinal direction thereof, the interferencehas a small influence on opposite sides and the value calculated inaccordance with the inequality is enough to obtain the effect ofattenuating the interference.

It is noted that the optical system in the laser irradiation apparatusof the present invention is not limited to the structure shown in thisembodiment mode.

[Embodiment 1]

A structure of the pixel in the light-emitting device, one of thesemiconductor devices formed with the laser irradiation apparatus of thepresent invention is explained with reference to FIG. 17.

In FIG. 17, a base film 6001 is formed on a substrate 6000, and atransistor 6002 is formed on the base film 6001. The transistor 6002 hasan active layer 6003, a gate electrode 6005, and a gate insulating film6004 sandwiched between the active layer 6003 and the gate electrode6005.

A poly-crystalline semiconductor film crystallized with the laserirradiation apparatus of the present invention is used as the activelayer 6003. It is noted that not only silicon but also silicon germaniummay be employed as the active layer. When the silicon germanium isemployed, it is preferable that the concentration of germanium isapproximately in the range of 0.01 atomic % to 4.5 atomic %.Alternatively silicon with carbon nitride added may be also employed.

Silicon oxide, silicon nitride, or silicon oxynitride can be employed inthe gate insulating film 6004. Alternatively, a film in which these arelaminated, for example a film in which SiN is laminated on SiO₂ may beemployed as the gate insulating film. The silicon oxide film was formedwith the plasma-CVD method in the mixed gas of TEOS (TetraethylOrthosilicate) and O₂, at a reaction pressure of 40 Pa, with a substratetemperature ranging from 300° C. to 400° C., by discharging at a highfrequency (13.56 MHz) with an electric density ranging from 0.5 W/cm² to0.8 W/cm². Thus manufactured silicon oxide film obtains a goodcharacteristic as the gate insulating film by performing the thermalannealing at a temperature ranging from 400° C. to 500° C. thereafter.Aluminum nitride can be used as the gate insulating film. The aluminumnitride is comparatively high in heat conductivity, and thereby the heatgenerated in TFT can be diffused effectively. Moreover, a film in whichthe aluminum nitride is laminated on the silicon oxide, siliconoxynitride, or the like not including aluminum may be used as the gateinsulating film. Furthermore, SiO₂ formed with RF sputtering methodusing Si as a target may be employed as the gate insulating film.

The gate electrode 6005 is formed of the element selected from the groupconsisting of Ta, W, Ti, Mo, Al, and Cu, or is formed of a chemicalcompound material or of an alloy material including the above element asits main component. Alternatively a semiconductor film, typically apoly-crystalline silicon film doped with the impurities such asphosphorous, may be employed. In addition, the gate electrode 6005 maybe formed of not only the conductive film of a single layer, but alsothe conductive films with a plurality of layers laminated.

In addition, it is preferable that these conductive films have astructure in which the first conductive film is formed of a tantalumnitride (TaN) and the second conductive film is formed of W, a structurein which the first conductive film is formed of a tantalum nitride (TaN)and the second conductive film is formed of Ti, a structure in which thefirst conductive film is formed of tantalum nitride (TaN) and the secondconductive film is formed of Al, or a structure in which the firstconductive film is formed of tantalum nitride (TaN) and the secondconductive film is formed of Cu. Moreover, the semiconductor film,typically the poly-crystalline silicon film doped with the impuritiessuch as phosphorous, or AgPdCu alloy may be employed as the first andthe second conductive films.

The conductive film may be formed not only in two-layers structure, butalso in three-layers structure in which for example a tungsten film, analloy film of aluminum and silicon (Al—Si), and a titanium nitride filmare laminated in order. When the conductive film is formed inthree-layers structure, tungsten nitride may be employed instead of thetungsten, an alloy film of aluminum and titanium (Al—Ti) may be employedinstead of the alloy film of aluminum and silicon (Al—Si), and atitanium film may be employed instead of the titanium nitride film. Itis important to select the optimum etching method and the optimum kindof etchant appropriately according to the material of the conductivefilm.

The transistor 6002 is covered with the first interlayer insulating film6006 on which the second interlayer insulating film 6007 and the thirdinterlayer insulating film 6008 are laminated. The first interlayerinsulating film 6006 can be formed of a silicon oxide film, a siliconnitride film, or a silicon oxynitride film in single layer or inlaminated layer with the plasma-CVD method or the sputtering method. Thefirst interlayer insulating film 6006 may be also formed of a film inwhich the silicon oxynitride film including more oxygen than nitrogen inmole fraction is formed on the silicon oxynitride film including morenitrogen than oxygen in mole fraction. When the heating process (heatingprocess at a temperature ranging from 300° C. to 550° C., for 1 hour to12 hours) is performed after forming the first interlayer insulatingfilm 6006, it is possible to terminate (hydrogenate) the dangling bondof the semiconductor included in the active layer 6003 by using hydrogenincluded in the first interlayer insulating film 6006.

The second interlayer insulating film 6007 may be formed of an organicresin film, an inorganic insulating film, an insulating film thatcomprises Si—CH_(X) bond and Si—O bond made from the material selectedfrom the siloxane group or the like. In this embodiment,non-photosensitive acrylic is used. The third interlayer insulating film6008 is formed of a film which is harder to transmit the materialcausing to promote deterioration of the light-emitting element such asmoisture, oxygen, and the like compared with the other insulating film.It is preferable to use typically a DLC film, a carbon nitride film, ora silicon nitride film formed by the RF sputtering method or the like.

In FIG. 17, a reference numeral 6010 denotes an anode, a referencenumeral 6011 denotes an electroluminescent layer, a reference numeral6012 denotes a cathode, and the part in which the anode 6010, theelectroluminescent layer 6011 and the cathode 6012 are overlappedcorresponds to a light-emitting element 6013. One of the transistors6002 is a driver transistor for controlling the current supplied to thelight-emitting element 6013 and thereby it is connected directly orserially through the other circuit element to the light-emitting element6013.

The electroluminescent layer 6011 has a single-layer structure of thelight-emitting layer or a laminated-layer structure of plural layersincluding the light-emitting layer.

The anode 6010 is formed on the third interlayer insulating film 6008.An organic resin film 6014 is formed as the barrier diffusion on thethird interlayer insulating film 6008. The organic resin film 6014 hasan opening 6015 and the light-emitting element 6013 is formed byoverlapping the anode 6010, the electroluminescent layer 6011 and thecathode 6012 in the opening 6015.

And a passivation film 6016 is formed on the organic resin film 6014 andthe cathode 6012. As well as the third interlayer insulating film 6008,the passivation film 6016 is formed of the film that is harder totransmit the material causing to promote deterioration of thelight-emitting element such as moisture and oxygen, for example a DLCfilm, a carbon nitride film, a silicon nitride film formed by the RFsputtering method, or the like. It is also possible to form thepassivation film by laminating the film described above that is hard totransmit moisture, oxygen, and the like and the film that is easier totransmit moisture, oxygen, and the like compared with the above film.

In addition, the organic resin film 6014 is heated in the vacuumatmosphere in order to remove the moisture, oxygen, and the like stuckthereto before the electroluminescent layer 6011 is formed.Specifically, the heating process is performed in the vacuum atmosphereat a temperature ranging from 100° C. to 200° C. for approximately 0.5hours to 1 hour. It is desirable that the pressure is set to 3×10⁻⁷ Torror less, and it is the most desirable that the pressure is 3×10⁻⁸ Torror less if possible. When the electroluminescent layer is formed afterthe heating process is performed to the organic resin film in the vacuumatmosphere, it is possible to enhance reliability by keeping it in thevacuum atmosphere until just before forming the electroluminescentlayer.

In addition, it is desirable that the end of the opening 6015 in theorganic resin film 6014 is made into a round shape so that the endportion of the electroluminescent element layer 6011 formed so as topartially overlap on the organic resin film 6014 does not have a hole.To be more specific, it is desirable that the radius of curvature of thecurve line drawn by the sectional surface of the organic resin film inthe opening is approximately in the range of 0.2 μm to 2 μm.

With the above structure, the coverage of the electroluminescent layer6011 and the cathode 6012 that are formed after forming the organicresin film can be enhanced, and thereby it is possible to prevent theanode 6010 and the cathode 6012 from shorting out in the hole formed inthe electroluminescent layer 6011. Moreover, by relaxing the stress ofthe electroluminescent layer 6011, the defect in which thelight-emitting region decreases, what is called shrink, can be reducedto enhance the reliability.

In addition, FIG. 17 shows an example in which a positive photosensitiveacrylic resin is used as the organic resin film 6014. The photosensitiveorganic resin is classified into the positive type in which the regionexposed with the energy line such as beam, electron, ion, or the like isremoved, and the negative type in which the exposed region is notremoved. In the present invention, the organic resin film of thenegative type may be also used. Moreover, the organic resin film 6014may be formed of the photosensitive polyimide. When the organic resinfilm 6014 is formed of the acrylic of the negative type, the end sectionin the opening 6015 shapes like a letter of S. On this occasion, it isdesirable that the radius of the curvature in the upper end and thelower end of the opening is in the range of 0.2 μm to 2 μm.

The anode 6010 can be formed of the transparent conductive film. Notonly ITO, but also the transparent conductive film in which indium oxideis mixed with tin oxide (ZnO) by 2% to 20% may be used. In FIG. 17, ITOis used as the anode 6010. The anode 6010 may be polished by CMP methodor by cleaning (bellcleaning) with porous body of polyvinyl alcohols sothat the surface of the anode 6010 is made flat. Furthermore, thesurface of the anode 6010 may be irradiated with the ultraviolet ray ormay be processed with oxygen plasma after polishing it with the CMPmethod.

The cathode 6012 can be formed of the other known material when it isthe conductive film whose work function is low. For example, Ca, Al,CaF, MgAg, AlLi, or the like is desirable.

It is noted that FIG. 17 shows the structure in which the light emittedfrom the light-emitting element is irradiated to the side of thesubstrate 6000. However, the structure in which the light is irradiatedto the side opposite to the substrate may be also employed.

In addition, in FIG. 17, the transistor 6002 is connected to the anode6010 of the light-emitting element but the present invention is notlimited to this structure, and the transistor 6002 may be connected tothe cathode 6012 of the light-emitting element. In this case, thecathode is formed on the third interlayer insulating film 6008 with TiNor the like.

In fact, after the state shown in FIG. 17 is obtained, it is preferableto pack (enclose) with the passivation film (laminated film, ultravioletcured resin film, or the like) or transparent cover member, which ishighly airtight and hardly degassing. The reliability of OLED isenhanced when the inside of the cover member is filled with the inertatmosphere or the material having moisture-absorption characteristics(barium oxide, for example) is set in the cover member.

It is noted that the light-emitting device of the present invention isnot limited to the manufacturing process described above. Moreover, thesemiconductor device in the present invention is not limited to thelight-emitting device.

[Embodiment 2]

This embodiment explains a shape of a beam spot obtained by combining aplurality of CW laser light.

FIG. 20(A) shows an example of the shape of the beam spot oscillatedfrom each of the plurality of laser oscillators on a processing object.The beam spot shown in FIG. 20(A) is elliptical in shape. It is notedthat the shape of the beam spot of the laser light oscillated from thelaser oscillator is not limited to elliptical in the present invention.The shape of the beam spot depends on the kind of the laser, and theshape thereof can be changed through an optical system. For example, thelaser light emitted from the excimer laser L3308 manufactured by LambdaPhysik, Inc. (wavelength 308 nm, pulse width 30 ns) is rectangular inshape having a size of 10 mm×30 mm (both are width at half maximum in abeam profile). On the other hand, the laser light emitted from a YAGlaser having a cylindrical rod is circular in shape. The laser lightemitted from a YAG laser having a slab rod is rectangular in shape.These laser light can be also changed into the laser light having adesired size by further shaping them through the optical system.

FIG. 20(B) shows energy density distribution of the laser light in Ydirection of a major axis of the beam spot shown in FIG. 20(A). The beamspot shown in FIG. 20(A) corresponds to the region satisfying the energydensity that is 1/e² of the peak value of the energy density in FIG.20(B). The energy density distribution of the laser light whose beamspot is elliptical becomes higher toward the center O of the elliptical.

Next, FIG. 20(C) shows the shape of the beam spots when the laser lighthaving the beam spot shown in FIG. 20(A) is combined. It is noted thatFIG. 20(C) shows the case in which four beam spots of the laser lightare overlapped to form one linear beam spot but the number of theoverlapped beam spots is not limited to this.

As shown in FIG. 20(C), the beam spot of the laser light are combined toform one beam spot in such a way that the major axis of each ellipticalbeam is corresponded and the beam spots are overlapped partially oneanother. It is noted that the straight line obtained by connecting thecenter O of each elliptical beam spot is defined as the center axis ofthe beam spot.

FIG. 20(D) shows the energy density distribution of the laser light in ydirection of the center axis of the beam spots after being combinedshown in FIG. 20(C). It is noted that the beam spot shown in FIG. 20(C)corresponds to the region satisfying the energy density that is 1/e² ofthe peak value of the energy density in FIG. 20(B). The energy densityis added in the portion in which each beam spot before being combined isoverlapped. For example, when the energy density E1 and the energydensity E2 of the overlapped beam spots as shown diagrammatically areadded, the added value is almost equal to the peak value E3 of theenergy density of the beam spot. Thus the energy density is made flatbetween the centers O of the respective elliptical beam spots.

It is ideal for the value added with E1 and E2 to be equal to E3. Infact, however, they are not always equal. It is possible for a designerto determine the margin of the gap between the value added with E1 andE2, and the value E3 appropriately.

As shown in FIG. 20(A), when the beam spot is employed singularly, it isdifficult to irradiate the semiconductor film or the whole part tobecome the island, which contacts the flat portion of the insulatingfilm, with the laser light having homogeneous energy density since thebeam spot has Gaussian energy distribution. FIG. 20(D) indicates,however, that it is possible to enhance the crystallinity of thesemiconductor film effectively because the region having homogeneousenergy density is more enlarged by employing a plurality of laser lightoverlapped so as to compensate the part having low energy density eachother than employing the laser light singularly not being overlappedwith a plurality of laser light.

It is possible to perform the structure of this embodiment incombination with the embodiment 1.

BRIEF DESCRIPTION OF DRAWINGS

[FIG. 1] drawings to show the relation between the direction of themagnetic lines of force and the scanning direction of the beam spot andthe substrate in the pulsed laser irradiation apparatus of the presentinvention.

[FIG. 2] drawings to show the relation between the direction of themagnetic lines of force and the scanning direction of the beam spot andthe substrate in the CW laser irradiation apparatus of the presentinvention.

[FIG. 3] drawings to show the relation between the direction of themagnetic lines of force and the scanning direction of the beam spot andthe substrate in the pulsed laser irradiation apparatus of the presentinvention.

[FIG. 4] drawings to show the relation between the direction of themagnetic lines of force and the scanning direction of the beam spot andthe substrate in the CW laser irradiation apparatus of the presentinvention.

[FIG. 5] drawings to show the relation between the direction of themagnetic lines of force and the scanning direction of the beam spot andthe substrate in the pulsed laser irradiation apparatus of the presentinvention.

[FIG. 6] drawings to show the relation between the direction of themagnetic lines of force and the scanning direction of the beam spot andthe substrate in the CW laser irradiation apparatus of the presentinvention.

[FIG. 7] drawings to show the relation between the direction of themagnetic lines of force and the scanning direction of the beam spot andthe substrate in the pulsed laser irradiation apparatus of the presentinvention.

[FIG. 8] drawings to show the relation between the direction of themagnetic lines of force and the scanning direction of the beam spot andthe substrate in the CW laser irradiation apparatus of the presentinvention.

[FIG. 9] drawings to show the method for manufacturing a semiconductordevice.

[FIG. 10] drawings to show the method for manufacturing a semiconductordevice.

[FIG. 11] drawings to show the method for manufacturing a semiconductordevice.

[FIG. 12] a drawing to show the structure of the pulsed laserirradiation apparatus having a load lock system chamber.

[FIG. 13] a drawing to show the structure of the CW laser irradiationapparatus having a load lock system chamber.

[FIG. 14] a drawing to show the structure of the pulsed laserirradiation apparatus.

[FIG. 15] a drawing to show the structure of the CW laser irradiationapparatus.

[FIG. 16] drawings to show the optical system in the laser irradiationapparatus.

[FIG. 17] a cross-sectional view of the light-emitting devicemanufactured with the laser irradiation apparatus of the presentinvention.

[FIG. 18] a graph to show the energy density in every shot of the pulsedlaser light, a graph to show the drain current density of TFT forsupplying current to the light-emitting TFT, and a photograph of thepixel portion that is enlightened in fact.

[FIG. 19] drawings to show a mechanism of the impurities intrusion intothe semiconductor film.

[FIG. 20] drawings to show energy density distribution of the beam spot.

1. A method for manufacturing a semiconductor device comprising: forminga semiconductor film including a first noble gas over an insulatingsurface; and irradiating laser light to the semiconductor film in anatmosphere of second noble gas, wherein a magnetic field is applied tothe semiconductor film including the first noble gas when the laserlight is irradiated.
 2. A method for manufacturing a semiconductordevice comprising: forming a semiconductor film including a first noblegas over an insulating surface; and irradiating laser light to thesemiconductor film in an atmosphere of second noble gas, wherein amagnetic field is applied to the semiconductor film including the firstnoble gas in a direction perpendicular to the semiconductor film whenthe laser light is irradiated.
 3. A method for manufacturing asemiconductor device comprising: forming a semiconductor film includinga first noble gas over an insulating surface; and irradiating laserlight to the semiconductor film in an atmosphere of second noble gas,wherein a magnetic field is applied to the semiconductor film includingthe first noble gas in a direction parallel to a scanning direction ofthe laser light when the laser light is irradiated.
 4. A method formanufacturing a semiconductor device comprising: forming a semiconductorfilm including a first noble gas over an insulating surface; andirradiating laser light to the semiconductor film in an atmosphere ofsecond noble gas, wherein a magnetic field is applied to thesemiconductor film including the first noble gas in a direction parallelto the semiconductor film and in a direction perpendicular to a scanningdirection of the laser light when the laser light is irradiated.
 5. Amethod for manufacturing a semiconductor device according to any one ofclaims 1 through 4, wherein the laser light is generated in a pulseoscillation.
 6. A method for manufacturing a semiconductor deviceaccording to any one of claims 1 through 4, wherein the laser light isgenerated in a continuous wave oscillation.
 7. A method formanufacturing a semiconductor device according to any one of claims 1through 4, wherein the first noble gas is selected from the groupconsisting of He, Ne, Ar, Kr, and Xe.
 8. A method for manufacturing asemiconductor device according to any one of claims 1 through 4, whereina concentration of the first noble gas in the semiconductor film is inthe range of 1×10¹⁸ atoms/cm³ to 1×10²¹) atoms/cm³.
 9. A method formanufacturing a semiconductor device according to any one of claims 1through 4, wherein a magnetic flux density of the magnetic field is inthe range of 1000 G to 10000 G.
 10. A method for manufacturing asemiconductor device according to any one of claims 1 through 4, whereinthe semiconductor device is a light-emitting device.
 11. A method formanufacturing a semiconductor device according to any one of claims 1 to4, wherein the semiconductor device employs a TFT having a concentrationof the first noble gas in an active layer in the range of 1×10¹⁸atoms/cm³ to 1×10²¹ atoms/cm³.
 12. A method for manufacturing asemiconductor device according to claim 11, wherein the first noble gasis selected from the group consisting of He, Ne, Ar, Kr, and Xe.
 13. Amethod for manufacturing a semiconductor device according to any one ofclaims 1 to 4, wherein the step of forming the semiconductor filmincluding the first noble gas comprises: forming a semiconductor filmover the insulating surface; and adding the first noble gas to thesemiconductor film.